By Katherine Bourzac, Technology Review
IBM will work with materials manufacturer 3M to develop the necessary mortar to build much more complex three-dimensional computer chips. The companies announced this week that they will aim to develop microchips made of 100 chip layers stacked on top of each other. Stacking chips in this way could make all sorts of electronics faster and more power-efficient. Three-dimensional chips have already found their way into some niche applications, but they are expensive to make, and can only be stacked about a dozen layers high before they overheat.
http://www.technologyreview.com/computing/38543/?p1=A4
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