Techno-News Blog Ray Schroeder, editor, OTEL - University of Illinois at Springfield |
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Tuesday, December 18, 2001
http://www.scientificamerican.com/2002/0102issue/0102lee.html A Vertical Leap for Microchips: Engineers have discovered a way to pack more computing power into microcircuits: build them vertically as well as horizontally By Thomas H. Lee, Scientific American VERTICAL STACK of memory cells can store eight bits of information in the area usually allotted to just one bit. Such "3-d" microchips are set to dramatically reduce the cost of digital memory....
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